DocumentCode :
1212840
Title :
Current-induced unidirectional migration of Si at Al/Si contact
Author :
Du, C.-H. ; Fujishima, M. ; Hoh, K.
Author_Institution :
Dept. of Electron. Eng., Tokyo Univ., Japan
Volume :
31
Issue :
24
fYear :
1995
fDate :
11/23/1995 12:00:00 AM
Firstpage :
2125
Lastpage :
2127
Abstract :
The invasion of Si atoms along the electron flow at a Al/Si contact was observed. The velocity and the amount of migrating Si atoms in the Al line were evaluated. It can be considered that the accumulation of Al vacancies at the contact owing to the electromigration, provides sites for Si atoms to occupy via thermal diffusion and electromigration
Keywords :
aluminium; electromigration; elemental semiconductors; metallisation; silicon; thermal diffusion; vacancies (crystal); Al line; Al-Si; Al/Si contact; current-induced unidirectional migration; electromigration; electron flow; thermal diffusion; vacancies;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19951421
Filename :
480751
Link To Document :
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