• DocumentCode
    1212840
  • Title

    Current-induced unidirectional migration of Si at Al/Si contact

  • Author

    Du, C.-H. ; Fujishima, M. ; Hoh, K.

  • Author_Institution
    Dept. of Electron. Eng., Tokyo Univ., Japan
  • Volume
    31
  • Issue
    24
  • fYear
    1995
  • fDate
    11/23/1995 12:00:00 AM
  • Firstpage
    2125
  • Lastpage
    2127
  • Abstract
    The invasion of Si atoms along the electron flow at a Al/Si contact was observed. The velocity and the amount of migrating Si atoms in the Al line were evaluated. It can be considered that the accumulation of Al vacancies at the contact owing to the electromigration, provides sites for Si atoms to occupy via thermal diffusion and electromigration
  • Keywords
    aluminium; electromigration; elemental semiconductors; metallisation; silicon; thermal diffusion; vacancies (crystal); Al line; Al-Si; Al/Si contact; current-induced unidirectional migration; electromigration; electron flow; thermal diffusion; vacancies;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19951421
  • Filename
    480751