DocumentCode :
121362
Title :
Monolithic Ni-electroplated microstructure and its application in micro mirrors and micro assembly
Author :
Yi Chiu ; Wen-Ching Lai ; Chun-Hao Chang ; Chun-Po Chang ; Ching-Hung Chen ; Chih-Hsiang Lai ; Wei-Hung Hsu
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2014
fDate :
17-21 Aug. 2014
Firstpage :
97
Lastpage :
98
Abstract :
This paper presents micro mirrors and micro assembly mechanisms fabricated by monolithic nickel electroplating. Multiple nickel structural layers were electroplated and patterned with copper as the sacrificial material. A novel side latch design was proposed and demonstrated for 3D micro assembly of micro mirrors by simple push operation of micro probes. Micro mirrors was assembled in about 15 sec in laboratory tests. The resonance frequency of the scanning mode of a stand-alone micro mirror was measured to be 4.753 kHz with a quality factor of about 470.
Keywords :
Q-factor; copper; electroplating; integrated optoelectronics; microassembling; microfabrication; micromirrors; nickel; 3D microassembly; Ni-Cu; copper; micromirrors; microprobes; microstructure; monolithic nickel electroplating; multiple nickel structural layers; push operation; quality factor; resonance frequency; scanning mode; side latch design; Assembly; Fabrication; Latches; Micromechanical devices; Mirrors; Nickel; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical MEMS and Nanophotonics (OMN), 2014 International Conference on
Conference_Location :
Glasgow
ISSN :
2160-5033
Print_ISBN :
978-0-9928-4140-9
Type :
conf
DOI :
10.1109/OMN.2014.6924611
Filename :
6924611
Link To Document :
بازگشت