Title :
Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track
Author :
Amon, C.H. ; Ramakrishna, K. ; Sammakia, Bahgat G. ; Joshi, Yogendra K.
Author_Institution :
Carnegie Mellon University
fDate :
3/1/2003 12:00:00 AM
Keywords :
Electronic packaging thermal management; Electronics cooling; Heat pumps; Heat sinks; Resistance heating; Special issues and sections; Technology management; Thermal conductivity; Thermal management; Thermal management of electronics;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.810756
