Title :
Evolution of cooling technology for electrical, electronic, and microelectronic equipment
Author :
Bergles, Arthur E.
fDate :
3/1/2003 12:00:00 AM
Abstract :
Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
Keywords :
cooling; heat sinks; heat transfer; history; integrated circuit design; packaging; vacuum tubes; cooling technology; electrical apparatus; electronic devices; heat transfer considerations; micro-channel heat sinks; microelectronic equipment; microelectronic system design; microminiaturization; vacuum tube; Design engineering; Electron tubes; Electronic packaging thermal management; Electronics cooling; Heat engines; Heat transfer; Machinery; Microelectronics; Thermal conductivity; Transmitters;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.809664
