DocumentCode
1214150
Title
Evolution of cooling technology for electrical, electronic, and microelectronic equipment
Author
Bergles, Arthur E.
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
6
Lastpage
15
Abstract
Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
Keywords
cooling; heat sinks; heat transfer; history; integrated circuit design; packaging; vacuum tubes; cooling technology; electrical apparatus; electronic devices; heat transfer considerations; micro-channel heat sinks; microelectronic equipment; microelectronic system design; microminiaturization; vacuum tube; Design engineering; Electron tubes; Electronic packaging thermal management; Electronics cooling; Heat engines; Heat transfer; Machinery; Microelectronics; Thermal conductivity; Transmitters;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.809664
Filename
1202898
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