Title :
Least-energy optimization of air-cooled heat sinks for sustainable development
Author :
Bar-Cohen, Avram ; Iyengar, Madhusudan
Author_Institution :
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
fDate :
3/1/2003 12:00:00 AM
Abstract :
The development of heat sinks for microelectronic applications, which are compatible with sustainable development, involves the achievement of a subtle balance between a superior thermal design, minimum material consumption, and minimum pumping power. This presentation explores the potential for the least-energy optimization of natural and forced convection cooled rectangular plate heat sinks. The results are evaluated in terms of a heat sink coefficient of performance, relating the cooling capability to the energy invested in the fabrication and operation of the heat sink, and compared to the entropy generation minimization methodology (EGM).
Keywords :
cooling; forced convection; heat sinks; integrated circuit packaging; minimisation; minimum entropy methods; natural convection; sustainable development; thermal resistance; air-cooled heat sinks; cooled rectangular plate heat sinks; cooling capability; entropy generation minimization methodology; forced convection; heat sink coefficient of performance; least-energy optimization; microelectronic applications; minimum material consumption; minimum pumping power; natural convection; plate-fin; sustainable development; thermal design; Design optimization; Entropy; Fabrication; Heat pumps; Heat sinks; Heat transfer; Investments; Sustainable development; Temperature; Thermal conductivity;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.811463
