DocumentCode :
1214268
Title :
PCM thermal control unit for portable electronic devices: experimental and numerical studies
Author :
Alawadhi, Esam M. ; Amon, Cristina H.
Author_Institution :
Dept. of Mech. Eng., Kuwait Univ., Safat, Kuwait
Volume :
26
Issue :
1
fYear :
2003
fDate :
3/1/2003 12:00:00 AM
Firstpage :
116
Lastpage :
125
Abstract :
This paper investigates the effectiveness of a thermal control unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices when their operating time is limited to a few hours. It is composed of an organic phase change material (PCM) and a thermal conductivity enhancer (TCE). To overcome the relatively low thermal conductivity of the PCM, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for modeling the TCU, which employ effective thermo-physical properties. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is then used to study the effect of important parameters that are experimentally expensive to examine, such as the PCM latent heat, Stefan number, and heat source power. It is shown that the TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement.
Keywords :
numerical analysis; phase transformations; thermal analysis; thermal conductivity; thermal management (packaging); thermal variables control; PCM thermal control unit; Stefan number; heat source power; latent heat; modeling; numerical model; numerical predictions; organic phase change material; portable electronic devices; thermal conductivity enhancer; thermal management; thermo-physical properties; Conducting materials; Electronic components; Electronics cooling; Heat transfer; Mechanical engineering; Phase change materials; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.811480
Filename :
1202910
Link To Document :
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