DocumentCode :
1214287
Title :
Special section on compact thermal modeling
Author :
Lasance, C.
Author_Institution :
Philips Research Laboratories
Volume :
26
Issue :
1
fYear :
2003
fDate :
3/1/2003 12:00:00 AM
Firstpage :
134
Lastpage :
135
Keywords :
Heat sinks; Packaging; Product design; Semiconductor device manufacture; Software design; Software tools; Special issues and sections; Standardization; Temperature; Virtual manufacturing;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.814000
Filename :
1202912
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1214287
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