DocumentCode
1214312
Title
Flow and pressure field characteristics in the porous block compact modeling of parallel plate heat sinks
Author
Narasimhan, Sridhar ; Bar-Cohen, Avram ; Nair, Rajesh
Author_Institution
Dept. of Mech. Eng., Univ. of Minnesota, Minneapolis, MN, USA
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
147
Lastpage
157
Abstract
Growing complexity has resulted in an increased computational effort in CFD modeling of electronic systems. To reduce the computational effort, one or several heat sinks can be represented by a compact "porous block" model, with an effective thermal conductivity and pressure loss coefficient. In this study of parallel plate heat sinks in laminar forced convection, a methodology is developed to analytically determine the fluid properties of compact heat sink models that provide acceptable levels of approximation. The results of an extensive set of CFD simulations for a three heat sink channel, covering three distinct heat sink geometries, air velocities from 0.25 m/s to 2 m/s and various spacings between the heat sinks, were used to create and evaluate the effectiveness of compact models. Use of a two term, equivalent loss coefficient-reflecting the linear and quadratic components in the pressure drop of a porous block-has led to good agreement between the detailed numerical and compact model predictions, with compact heat sink pressure drops usually slightly higher (<10%) than detailed heat sink pressure drops.
Keywords
computational fluid dynamics; forced convection; heat sinks; laminar flow; modelling; porous materials; pressure; thermal analysis; thermal conductivity; thermal management (packaging); 0.25 to 2 m/s; CFD modeling; boundary layer methodology; effective thermal conductivity; electronic systems; flow characteristics; linear components; loss coefficients; model predictions; parallel plate heat sinks; porous block compact modeling; pressure field characteristics; pressure loss coefficient; quadratic components; two term equivalent loss coefficient; Computational fluid dynamics; Concurrent computing; Geometry; Heat sinks; Packaging; Power system modeling; Predictive models; Resistance heating; Solid modeling; Thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.811861
Filename
1202914
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