DocumentCode :
1214312
Title :
Flow and pressure field characteristics in the porous block compact modeling of parallel plate heat sinks
Author :
Narasimhan, Sridhar ; Bar-Cohen, Avram ; Nair, Rajesh
Author_Institution :
Dept. of Mech. Eng., Univ. of Minnesota, Minneapolis, MN, USA
Volume :
26
Issue :
1
fYear :
2003
fDate :
3/1/2003 12:00:00 AM
Firstpage :
147
Lastpage :
157
Abstract :
Growing complexity has resulted in an increased computational effort in CFD modeling of electronic systems. To reduce the computational effort, one or several heat sinks can be represented by a compact "porous block" model, with an effective thermal conductivity and pressure loss coefficient. In this study of parallel plate heat sinks in laminar forced convection, a methodology is developed to analytically determine the fluid properties of compact heat sink models that provide acceptable levels of approximation. The results of an extensive set of CFD simulations for a three heat sink channel, covering three distinct heat sink geometries, air velocities from 0.25 m/s to 2 m/s and various spacings between the heat sinks, were used to create and evaluate the effectiveness of compact models. Use of a two term, equivalent loss coefficient-reflecting the linear and quadratic components in the pressure drop of a porous block-has led to good agreement between the detailed numerical and compact model predictions, with compact heat sink pressure drops usually slightly higher (<10%) than detailed heat sink pressure drops.
Keywords :
computational fluid dynamics; forced convection; heat sinks; laminar flow; modelling; porous materials; pressure; thermal analysis; thermal conductivity; thermal management (packaging); 0.25 to 2 m/s; CFD modeling; boundary layer methodology; effective thermal conductivity; electronic systems; flow characteristics; linear components; loss coefficients; model predictions; parallel plate heat sinks; porous block compact modeling; pressure field characteristics; pressure loss coefficient; quadratic components; two term equivalent loss coefficient; Computational fluid dynamics; Concurrent computing; Geometry; Heat sinks; Packaging; Power system modeling; Predictive models; Resistance heating; Solid modeling; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.811861
Filename :
1202914
Link To Document :
بازگشت