• DocumentCode
    1214328
  • Title

    Equivalent thermal conductivity for compact heat sink models based on the Churchill and Chu correlation

  • Author

    Brucker, Kyle A. ; Majdalani, Joseph

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Cornell Univ., Ithaca, NY, USA
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    158
  • Lastpage
    164
  • Abstract
    In this study an asymptotic technique is presented for calculating the equivalent thermal conductivity of a compact heat sink model. The method uses the known Nusselt number correlation given by Churchill and Chu (1975) for both laminar and turbulent regimes. This correlation is valid for airflow over a vertical flat plate and is applicable over the entire range of Rayleigh and Prandtl numbers. The resulting asymptotic solution presented here is applicable for overall heat transfer coefficients ranging from 0 to 100,000 Wm-2K-1. The closed-form analytical solution is compared to an iterative numerical solution and found to exhibit a very small error over a wide range of flow conditions. Being practically equivalent to the numerical solution, the asymptotic correlation obviates the need for guesswork and iteration in a compact heat sink simulation. It enables the implementation of a self-contained numerical scheme that does not require user intervention.
  • Keywords
    cooling; correlation methods; heat sinks; modelling; numerical analysis; thermal analysis; thermal conductivity; thermal management (packaging); Nusselt number correlation; airflow; asymptotic technique; compact heat sink model; compact heat sink simulation; equivalent thermal conductivity; heat transfer coefficients; laminar regimes; multichip electronic cooling; self-contained numerical scheme; turbulent regimes; vertical flat plate; Design optimization; Ducts; Electronics cooling; Heat sinks; Heat transfer; Temperature dependence; Thermal conductivity; Thermal expansion; Viscosity; Water heating;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.806173
  • Filename
    1202915