DocumentCode
1214346
Title
Thermal compact models: an alternative approach
Author
Bosch, Eric G.T.
Author_Institution
Philips Res., Eindhoven, Netherlands
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
173
Lastpage
178
Abstract
Thermal compact models enable the prediction of junction temperatures of complicated components in a system level numerical simulation with a minimum of computational effort. A method for generating compact models has been proposed by the DELPHI consortium. Here a new approach is proposed that is no longer based on a statistical treatment using optimization but on analyzing the heat flux distributions that occur. Using this new approach a new method for generating compact models is suggested, which obtains models that are, in principle, equal to the models found using the DELPHI approach, but at virtually no computational effort. The analysis puts compact models on a firm mathematical and physical basis and proves that no linear model with a limited number of nodes can ever be truly boundary condition independent. Furthermore, it is shown that the shape of the distribution function of the heat flux over the external surfaces of the component determines both the number of nodes needed in the compact model and its accuracy.
Keywords
heat transfer; modelling; temperature distribution; thermal analysis; thermal management (packaging); thermal resistance; DELPHI approach; PROFIT; heat flux distributions analysis; junction temperatures prediction; model generation; system level numerical simulation; thermal characterization; thermal compact models; Boundary conditions; Computational modeling; Distribution functions; Heat treatment; Mathematical model; Numerical simulation; Predictive models; Shape; Temperature distribution; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.808004
Filename
1202917
Link To Document