Title :
Compact thermal models for electronic systems
Author :
Sabry, Mohamed-Nabil
Author_Institution :
Mentor Graphics, Cairo, Egypt
fDate :
3/1/2003 12:00:00 AM
Abstract :
Compact thermal models have been constructed for different levels in electronic systems with a variable degree of success. In this work first steps toward constructing a unifying theory are presented for linear systems giving general constraints on the form of the compact model that will ensure an adequate description of thermal systems. The theory is also used to study the completeness of the set of boundary conditions used to derive and/or validate thermal compact models.
Keywords :
heat transfer; modelling; printed circuits; thermal analysis; thermal management (packaging); PCB; boundary conditions; compact thermal models; electronic systems; linear systems; packaging; thermal management; thermal systems; unifying theory; Boundary conditions; Constraint theory; Electronic packaging thermal management; Fluid dynamics; Heat transfer; Linear systems; Printed circuits; Thermal conductivity; Thermal management; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.808009