DocumentCode :
1214356
Title :
Compact thermal models for electronic systems
Author :
Sabry, Mohamed-Nabil
Author_Institution :
Mentor Graphics, Cairo, Egypt
Volume :
26
Issue :
1
fYear :
2003
fDate :
3/1/2003 12:00:00 AM
Firstpage :
179
Lastpage :
185
Abstract :
Compact thermal models have been constructed for different levels in electronic systems with a variable degree of success. In this work first steps toward constructing a unifying theory are presented for linear systems giving general constraints on the form of the compact model that will ensure an adequate description of thermal systems. The theory is also used to study the completeness of the set of boundary conditions used to derive and/or validate thermal compact models.
Keywords :
heat transfer; modelling; printed circuits; thermal analysis; thermal management (packaging); PCB; boundary conditions; compact thermal models; electronic systems; linear systems; packaging; thermal management; thermal systems; unifying theory; Boundary conditions; Constraint theory; Electronic packaging thermal management; Fluid dynamics; Heat transfer; Linear systems; Printed circuits; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2002.808009
Filename :
1202918
Link To Document :
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