Title :
Thermal performance of aluminum-foam heat sinks by forced air cooling
Author :
Kim, Seo Young ; Paek, Jin Wook ; Kang, Byung Ha
Author_Institution :
Thermal/Flow Control Res. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
fDate :
3/1/2003 12:00:00 AM
Abstract :
Experiments have been carried out to investigate the heat transfer characteristics of an aluminum-foam heat sink placed on a heat source in a channel. The thermal performance of aluminum-foam heat sinks is evaluated in terms of the Nusselt number and thermal resistance of the heat sinks. The pore density of the aluminum-foam heat sinks and the Reynolds number are varied in the range of parameters: 10, 20, 40 pores per inch (PPI) and 710≤Re≤2900, respectively. It is found that thermal resistance is substantially reduced by employing an aluminum-foam heat sink with low pore density due to the relatively intense airflow through the heat sink. The aluminum-foam heat sink may provide 28% or higher thermal performance than a conventional parallel-plate heat sink of the same size. Further, the aluminum-foam heat sinks can dramatically reduce the overall mass of electronics-cooling devices owing to high porosity.
Keywords :
aluminium; cooling; flow; foams; forced convection; heat sinks; permeability; porosity; porous materials; thermal analysis; thermal conductivity; thermal management (packaging); thermal resistance; Al; Al-foam heat sinks; Nusselt number; Reynolds number; electronics cooling; forced convection; pore density; thermal performance; thermal resistance; Electronics cooling; Heat sinks; Heat transfer; Resistance heating; Surface resistance; Temperature; Thermal conductivity; Thermal engineering; Thermal force; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.809540