• DocumentCode
    1214488
  • Title

    2001 needs for multi-level interconnect technology

  • Author

    Oh, Soo-Young ; Chan, Keh-Jeng

  • Author_Institution
    Hewlett-Packard Co., Palo Alto, CA, USA
  • Volume
    11
  • Issue
    1
  • fYear
    1995
  • fDate
    1/1/1995 12:00:00 AM
  • Firstpage
    16
  • Lastpage
    21
  • Abstract
    Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis are too time-consuming to be practical. The tool used in this study to model a hypothetical interconnect system was Hewlett Packard´s HTVE (HP Interconnect Value Extractor)
  • Keywords
    ULSI; VLSI; circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; HP Interconnect Value Extractor; HTVE; ULSI; VLSI; interconnect parameters; multi-level interconnect technology; thermal alternatives; Capacitance; Clocks; Crosstalk; Delay lines; Frequency; Integrated circuit interconnections; Microprocessors; Reduced instruction set computing; Routing; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.340307
  • Filename
    340307
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1214488