Title :
2001 needs for multi-level interconnect technology
Author :
Oh, Soo-Young ; Chan, Keh-Jeng
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
1/1/1995 12:00:00 AM
Abstract :
Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis are too time-consuming to be practical. The tool used in this study to model a hypothetical interconnect system was Hewlett Packard´s HTVE (HP Interconnect Value Extractor)
Keywords :
ULSI; VLSI; circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; HP Interconnect Value Extractor; HTVE; ULSI; VLSI; interconnect parameters; multi-level interconnect technology; thermal alternatives; Capacitance; Clocks; Crosstalk; Delay lines; Frequency; Integrated circuit interconnections; Microprocessors; Reduced instruction set computing; Routing; Ultra large scale integration;
Journal_Title :
Circuits and Devices Magazine, IEEE
