Title :
Finite element analysis extends its domain
Author :
Rodamaker, Mark C.
Author_Institution :
MCR Associates, USA
fDate :
1/1/1995 12:00:00 AM
Abstract :
Finite element analysis (FEA), traditionally used to predict stress and dynamic response in mechanical systems, is finding its way into a wider realm of electrical engineering applications. These tasks range from finding the temperature distribution in IC packages, to analyzing mechanical and electrical faults in disk drives. This article addresses the capabilities of such programs to solve critical engineering problems by presenting an overview of current and potential uses for FEA in electrical engineering
Keywords :
electrical engineering; electrical engineering computing; finite element analysis; FEA; critical engineering problems; electrical engineering applications; electrical faults; finite element analysis; mechanical faults; temperature distribution; Computer networks; Disk drives; Electrical engineering; Finite element methods; Integrated circuit interconnections; Integrated circuit packaging; Resistors; Stress; Temperature distribution; Transmission line matrix methods;
Journal_Title :
Circuits and Devices Magazine, IEEE
