• DocumentCode
    121471
  • Title

    Modeling and fabrication of GaAs solar cells with high dislocation tolerance

  • Author

    Mehrotra, Akhil ; Wei Wang ; Freundlich, Alex

  • Author_Institution
    Photovoltaic & Nanostruct. Labs., Univ. of Houston, Houston, TX, USA
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Abstract
    In this work we have evaluated thickness dependence of efficiency on high dislocated solar cells using MBE (for GaAs solar cells). Drift-diffusion modeling results show that by using ultra-thin design in solar cells with defects and/or high surface recombination, efficiency degradation could be prevented. Modeling results match with fabricated dislocated GaAs solar cells, thus improving the efficiency of hetero-epitaxial and metamorphic solar cells, without having need to grow thick buffers and/or using defect filtering techniques. Isc measurement with etching technique has been discussed, to find most of device parameters, such as SRH lifetime, surface recombination velocities and minority carrier diffusion lengths, without having need to grow multiple growths or TRPL structures; this technique could be extended to any III-V devices to find out efficiency limiting device parameters.
  • Keywords
    III-V semiconductors; carrier mobility; diffusion; dislocation etching; elemental semiconductors; gallium arsenide; solar cells; surface recombination; III-V devices; SRH lifetime; drift-diffusion modeling; etching technique; gallium arsenide solar cell fabrication; gallium arsenide solar cell modelling; hetero-epitaxial solar cell efficiency improvement; high dislocation tolerance; metamorphic solar cell efficiency improvement; minority carrier diffusion lengths; surface recombination velocities; Etching; Gallium arsenide; Indium gallium arsenide; Photovoltaic cells; Radiative recombination; Substrates; GaAs solar cell; III–V; defects; lifetimes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6924972
  • Filename
    6924972