DocumentCode :
121532
Title :
The effect of building integration on the temperature and performance of photovoltaic modules
Author :
Gunawan, Aldy ; Hiralal, Pritesh ; Amaratunga, G.A.J. ; Tan, K.T. ; Elmes, Stuart
Author_Institution :
Dept. of Eng., Univ. of Cambridge, Cambridge, UK
fYear :
2014
fDate :
8-13 June 2014
Abstract :
Building integrated photovoltaics (BIPV), in particular roof-integrated PV is an aesthetically attractive option for many homes, but is understood to perform slightly below on-roof mounting of traditional modules as a result of the poorer ventilation. Previous studies have attempted to quantify this effect empirically for a variety of cell types. However, the performance varies significantly with location, both due to weather conditions and local construction practices, which in turn leads to different levels of ventilation and thermal gradients. We hereby use a purpose built roof construction with 4 different roof configurations and integrate monocrystalline Si modules in each to quantify differences in annual yields resulting from each roof type. Over the course of a year, a module embedded in the most common tiled roof type generates ca. 3% less energy than an onroof equivalent.
Keywords :
building integrated photovoltaics; elemental semiconductors; silicon; ventilation; BIPV; Si; building integration effect; building-integrated photovoltaics; local construction practice; monocrystalline silicon modules; on-roof mounting; photovoltaic module performance; photovoltaic module temperature; roof configurations; roof construction; roof-integrated PV; thermal gradient; tiled roof type; ventilation; weather condition; Mathematical model; Temperature distribution; Temperature measurement; Ventilation; Wind speed; BIPV; photovoltaic cells; roof integrated; silicon; thermal losses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
Type :
conf
DOI :
10.1109/PVSC.2014.6925033
Filename :
6925033
Link To Document :
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