• DocumentCode
    1215355
  • Title

    Is SOD Technology the Solution to Heating Problems in SOI Devices?

  • Author

    Raleva, Katerina ; Vasileska, Dragica ; Goodnick, Stephen M.

  • Author_Institution
    FEIT, Univ. of Kiril & Metodi, Skopje
  • Volume
    29
  • Issue
    6
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    621
  • Lastpage
    624
  • Abstract
    In this letter, we present our investigations on heating effects in Si on diamond and Si on AlN transistors, using a coupled Monte Carlo/thermal moment expansion simulator. Both technologies are considered viable alternatives to silicon-on-insulator devices due to the fact that diamond and AlN have significantly higher thermal conductivities than SiO2. This fact is beneficial in the following two aspects, as demonstrated in this letter: (1) It leads to a significant reduction in the thermal degradation of the device electrical characteristics, and (2) it allows a more uniform distribution of temperature in the device active region, which, in turn, enhances heat removal.
  • Keywords
    Monte Carlo methods; silicon-on-insulator; thermal conductivity; transistors; SOI devices; aluminum nitride transistors; coupled Monte Carlo methods; heat removal; silicon-on-insulator devices; thermal conductivities; thermal moment expansion simulator; uniform distribution; Electrothermal effects; modeling and simulation; particle-based device simulation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.920756
  • Filename
    4516980