DocumentCode
1215355
Title
Is SOD Technology the Solution to Heating Problems in SOI Devices?
Author
Raleva, Katerina ; Vasileska, Dragica ; Goodnick, Stephen M.
Author_Institution
FEIT, Univ. of Kiril & Metodi, Skopje
Volume
29
Issue
6
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
621
Lastpage
624
Abstract
In this letter, we present our investigations on heating effects in Si on diamond and Si on AlN transistors, using a coupled Monte Carlo/thermal moment expansion simulator. Both technologies are considered viable alternatives to silicon-on-insulator devices due to the fact that diamond and AlN have significantly higher thermal conductivities than SiO2. This fact is beneficial in the following two aspects, as demonstrated in this letter: (1) It leads to a significant reduction in the thermal degradation of the device electrical characteristics, and (2) it allows a more uniform distribution of temperature in the device active region, which, in turn, enhances heat removal.
Keywords
Monte Carlo methods; silicon-on-insulator; thermal conductivity; transistors; SOI devices; aluminum nitride transistors; coupled Monte Carlo methods; heat removal; silicon-on-insulator devices; thermal conductivities; thermal moment expansion simulator; uniform distribution; Electrothermal effects; modeling and simulation; particle-based device simulation;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.920756
Filename
4516980
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