DocumentCode :
1215355
Title :
Is SOD Technology the Solution to Heating Problems in SOI Devices?
Author :
Raleva, Katerina ; Vasileska, Dragica ; Goodnick, Stephen M.
Author_Institution :
FEIT, Univ. of Kiril & Metodi, Skopje
Volume :
29
Issue :
6
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
621
Lastpage :
624
Abstract :
In this letter, we present our investigations on heating effects in Si on diamond and Si on AlN transistors, using a coupled Monte Carlo/thermal moment expansion simulator. Both technologies are considered viable alternatives to silicon-on-insulator devices due to the fact that diamond and AlN have significantly higher thermal conductivities than SiO2. This fact is beneficial in the following two aspects, as demonstrated in this letter: (1) It leads to a significant reduction in the thermal degradation of the device electrical characteristics, and (2) it allows a more uniform distribution of temperature in the device active region, which, in turn, enhances heat removal.
Keywords :
Monte Carlo methods; silicon-on-insulator; thermal conductivity; transistors; SOI devices; aluminum nitride transistors; coupled Monte Carlo methods; heat removal; silicon-on-insulator devices; thermal conductivities; thermal moment expansion simulator; uniform distribution; Electrothermal effects; modeling and simulation; particle-based device simulation;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.920756
Filename :
4516980
Link To Document :
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