DocumentCode
1215597
Title
Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)
Author
Naeemi, Azad ; Sarvari, Reza ; Meindl, James D.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
Volume
26
Issue
2
fYear
2005
Firstpage
84
Lastpage
86
Abstract
Physical models are used to determine the ultimate potential performance of carbon nanotube interconnects and compare them with minimum-size copper wires implemented at various technology generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube bundles with larger wave speeds must be used. At the 45-nm node (year 2010), the performance enhancement that can be achieved by using nanotube bundles is negligible, and at the 22-nm node (year 2016) it can be as large as 80%.
Keywords
ULSI; carbon nanotubes; integrated circuit interconnections; molecular electronics; quantum wires; wave propagation; 22 nm; 45 nm; C; Cu; carbon nanotube interconnects; copper interconnects; gigascale integration; kinetic inductance; minimum-size copper wires; molecular electronics; nanotube bundles; quantum wires; wave propagation; Carbon nanotubes; Copper; Electrons; Electrostatics; Inductance; Integrated circuit interconnections; Kinetic theory; Particle scattering; Quantum capacitance; Wires;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2004.841440
Filename
1386402
Link To Document