• DocumentCode
    1215597
  • Title

    Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)

  • Author

    Naeemi, Azad ; Sarvari, Reza ; Meindl, James D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    26
  • Issue
    2
  • fYear
    2005
  • Firstpage
    84
  • Lastpage
    86
  • Abstract
    Physical models are used to determine the ultimate potential performance of carbon nanotube interconnects and compare them with minimum-size copper wires implemented at various technology generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube bundles with larger wave speeds must be used. At the 45-nm node (year 2010), the performance enhancement that can be achieved by using nanotube bundles is negligible, and at the 22-nm node (year 2016) it can be as large as 80%.
  • Keywords
    ULSI; carbon nanotubes; integrated circuit interconnections; molecular electronics; quantum wires; wave propagation; 22 nm; 45 nm; C; Cu; carbon nanotube interconnects; copper interconnects; gigascale integration; kinetic inductance; minimum-size copper wires; molecular electronics; nanotube bundles; quantum wires; wave propagation; Carbon nanotubes; Copper; Electrons; Electrostatics; Inductance; Integrated circuit interconnections; Kinetic theory; Particle scattering; Quantum capacitance; Wires;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2004.841440
  • Filename
    1386402