Title :
Simplified Macromodel of MTLs With Incident Fields (SiMMIF)
Author :
Shinh, Gurpreet S. ; Achar, Ramachandra ; Nakhla, Natalie M. ; Nakhla, Michel S. ; Erdin, Ihsan
Author_Institution :
Nvidia Corp., Santa Clara, CA
fDate :
5/1/2008 12:00:00 AM
Abstract :
Electromagnetic compatibility (EMC) analysis of high-speed designs has become imperative due to rapidly increasing radio-frequency interference and emerging technological trends such as higher operating frequencies, denser layouts, and multifunction convergent products. In this paper, a simplified macromodel of multiconductor transmission lines (MTLs) exposed to incident fields is presented. The proposed formulation can also handle frequency dependence of resistance, capacitance, conductance, and inductance (RLGC) line parameters. The method employs the recently developed delay-extraction-based compact and passive MTL macromodel, while developing closed-form expressions for incident field analysis. An error bound for the proposed macromodel is also presented. The macromodel is simulation program with integrated circuit emphasis (SPICE) compatible and overcomes the mixed frequency/time simulation difficulties usually encountered during transient analysis, while guaranteeing the stability of the global transient simulation. The algorithm provides higher accuracy as well as significant speed gains for EMC analysis of transmission line networks as compared to the existing techniques.
Keywords :
SPICE; circuit simulation; electromagnetic compatibility; multiconductor transmission lines; radiofrequency interference; EMC analysis; MTL macromodel; electromagnetic compatibility; high-speed design; incident field analysis; integrated circuit emphasis; multiconductor transmission line; radio-frequency interference; transient analysis; transmission line network; Analytical models; Circuit simulation; Electromagnetic analysis; Electromagnetic compatibility; Electromagnetic compatibility and interference; Multiconductor transmission lines; Radio frequency; Radiofrequency interference; SPICE; Transient analysis; Circuit simulation; delay extraction; distributed interconnects; electromagnetic coupling; electromagnetic interference (EMI); high-speed modules; incident fields; method of characteristics (MoC); multiconductor transmission lines (MTLs); passive macromodels; printed circuit boards (PCBs); transient ; transient analysis;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2008.922788