DocumentCode
121586
Title
Dark current suppression in quantum dot solar cells through interfacial engineering
Author
Butt, Nauman Z. ; Sarwar, Arslan ; Sadiq, Maham Masood ; Mazher, Khurram Usman
Author_Institution
Dept. of Electr. Eng., Lahore Univ. of Manage. & Sci. (LUMS), Lahore, Pakistan
fYear
2014
fDate
8-13 June 2014
Firstpage
1027
Lastpage
1032
Abstract
Thin interfacial insulators made of materials such as Lithium Fluoride or various oxide compositions have been shown to improve open circuit voltage and fill factor in quantum dot solar cells primarily due to the lowering of surface recombination leakage and the prevention of metal penetration into the active layer. In this paper, we highlight that, besides the above mentioned benefits, the thin interfacial barrier could also significantly lower the dark current leakage and hence could provide an additional performance improvement when dark current leakage is dominant. We computationally explore how the dark current suppression could affect the cell characteristics as a function of interfacial layer thickness, carrier mobility, and the recombination lifetime. We show that an ultrathin (~10A) interfacial layer could significantly improve cell efficiency when carrier mobility is relatively high and the dark current is significantly suppressed due to the presence of a tunneling barrier.
Keywords
carrier mobility; quantum dots; solar cells; carrier mobility; cell efficiency; dark current suppression; fill factor; interfacial engineering; interfacial layer thickness; metal penetration prevention; open circuit voltage; oxide compositions; performance improvement; quantum dot solar cells; recombination lifetime; surface recombination leakage; thin interfacial barrier; thin interfacial insulators; tunneling barrier; Electric potential; Electrostatics; Indexes; Indium tin oxide; Lighting; Materials; Metals; dark current; efficiency; interfacial layer; quantum dot solar cell;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location
Denver, CO
Type
conf
DOI
10.1109/PVSC.2014.6925088
Filename
6925088
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