DocumentCode :
1216520
Title :
The missing kink to seamless simulation [nanometer CMOS ULSI]
Author :
Xing Zhou
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Volume :
19
Issue :
3
fYear :
2003
fDate :
5/1/2003 12:00:00 AM
Firstpage :
9
Lastpage :
17
Abstract :
This paper reviews the trends and needs in multilevel modeling in the context of nanometer CMOS ULSI systems, with an emphasis from the model/tool developer´s perspective. A dual representation of the transistors/circuit is proposed and demonstrated through physics-based compact modeling and a single-engine circuit simulator based on subcircuit expansion. Extension to process correlation and block-level representation is also proposed, which will be the key to studying process effects on system performance. This consistent dual representation allows detailed physics captured at a lower level to be propagated to the higher level of abstraction. The key idea is to build a physics-based device compact model (CM) based on technology characterization, which serves as the building block for an implicit multilevel circuit simulator based on a subcircuit-expansion approach. In this way, process variation can be captured through device CMs, and its effects on circuit/system performance can be linked to a consistent hierarchy of abstractions within the same simulator engine.
Keywords :
CMOS integrated circuits; ULSI; circuit simulation; electronic design automation; integrated circuit modelling; mixed analogue-digital integrated circuits; nanoelectronics; system-on-chip; technology CAD (electronics); TCAD tools; block-level representation; dual representation; hierarchical modeling; multilevel circuit simulator; multilevel modeling; nanometer CMOS ULSI systems; physics-based compact modeling; process correlation; process variation; single-engine circuit simulator; subcircuit expansion; technology CAD; technology characterization; Capacitance-voltage characteristics; Circuit simulation; Circuit synthesis; Delay estimation; Electronic design automation and methodology; Logic circuits; Logic design; Logic devices; Semiconductor device modeling; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/MCD.2003.1203173
Filename :
1203173
Link To Document :
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