• DocumentCode
    1217779
  • Title

    Measured Performance of Different Solders in Bi2223/Ag Current Leads

  • Author

    Hiltunen, I. ; Korpela, A. ; Laine, H. ; Lehtonen, J. ; Lyly, M. ; Mikkonen, R.

  • Author_Institution
    Inst. of Electromagn., Tampere Univ. of Technol., Tampere
  • Volume
    18
  • Issue
    2
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    1427
  • Lastpage
    1430
  • Abstract
    In superconducting magnet systems the current leads are usually divided into two parts. Normal metal like brass or copper is often used in the first part from the room temperature to the temperature of the radiation shield. The second part down to the magnet is made of high temperature superconductors (HTS). HTS leads can reduce the conductive heat load because they have poor thermal conductivity. Since HTS wires are lossless with direct current and have fair tolerance to the magnetic field only Ohmic losses are generated in the contact resistances at the current terminals. Thus, efficient current leads require that appropriate solders are used to reduce the contact resistances. In this paper, the thermal and contact resistances as well as thermal conduction losses of Bi-2223/Ag current leads are experimentally investigated using indium- and tin-based solders at operation temperatures between 20 and 77 K. Finally, the measured data is utilized to design an efficient HTS current lead to the current range of 0-1000 A.
  • Keywords
    bismuth compounds; high-temperature superconductors; ohmic contacts; solders; superconducting magnets; thermal conductivity; thermal resistance; Bi2223/Ag current leads; Ohmic losses; conductive heat load; contact resistance; high temperature superconductors; magnetic field; radiation shield; solders; superconducting magnet systems; thermal conduction losses; thermal conductivity; thermal resistance; Bi-2223; current lead; electrical resistivity; joints; solder; thermal conductance;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2008.920618
  • Filename
    4519801