Study of Al/a-SiC/c-Si(p)/Al structure prepared by PECVD

Author

Vary, Michal ; Huran, Jozef ; Perny, Milan ; Mikolasek, M. ; Saly, Vladimir ; Packa, Juraj ; Kobzev, Alexander P.

Author_Institution

Fac. of Electr. Eng. & Inf. Technol., Slovak Univ. of Technol., Bratislava, Slovakia

fYear

2014

fDate

8-13 June 2014

Firstpage

1879

Lastpage

1883

Abstract

The heterojunction structure which consists of amorphous SiC layer deposited on p-type silicon substrate was prepared at various substrate temperatures and studied to optimize the technology and improve the quality of the interface. Rutherford Backscattering Spectroscopy (RBS) and Elastic Recoil Detection (ERD) structural analysis was employed in determination the concentrations of elements. Current-voltage (I-V) measurements were processed in order to obtained basic electric and PV parameters of prepared samples. Biased impedance spectra of Al/a-SiC/c-Si(p)/Al heterojunction in the dark are reported and analyzed. AC measurements in the dark conditions were processed in order to identify electronic behavior using equivalent AC circuit which was suggested and obtained by fitting of measured impedance data. A phenomenon of negative capacitance/resistance in certain frequency range has been observed.

Keywords

aluminium; chemical vapour deposition; equivalent circuits; silicon compounds; spectroscopy; AC measurements; Al-SiC-Si-Al; PECVD; PV parameters; Rutherford backscattering spectroscopy; current-voltage measurements; dark conditions; elastic recoil detection; electronic behavior; equivalent AC circuit; heterojunction structure; impedance spectra; negative capacitance-resistance; p-type silicon substrate; structural analysis; Capacitance; Current measurement; Heterojunctions; Silicon; Silicon carbide; Temperature measurement; Voltage measurement; PECVD; complex impedance; heterojunction; silicon carbide; structural analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th

Conference_Location

Denver, CO

Type

conf

DOI

10.1109/PVSC.2014.6925291

Filename

6925291