• DocumentCode
    1219747
  • Title

    Lifetimes of polypropylene films under combined high electric fields and thermal stresses

  • Author

    Cygan, P. ; Krishnakumar, B. ; Laghari, J.R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
  • Volume
    24
  • Issue
    4
  • fYear
    1989
  • fDate
    8/1/1989 12:00:00 AM
  • Firstpage
    619
  • Lastpage
    625
  • Abstract
    The lifetimes of polypropylene films under high AC and DC field stresses were determined at 23, 70, and 90°C. A two-parameter Weibull distribution was used in the evaluation of the data, with the shape and scale parameters estimated using graphical and maximum-likelihood methods. For DC aging, the results indicate that a power-law type of relation may hold true, with the parameters changing with temperature. However, for AC aging more anomalous results were obtained. These anomalies were more noticeable in the intermediate voltage region where the 23°C lifecurve fell below the lifecurves at the other two temperatures. This is possibly due to the partial discharges which are mainly responsible for the breakdown in this range of voltage and the progressive impregnation of the dielectric films with transformer oil
  • Keywords
    ageing; electric breakdown of solids; insulation testing; life testing; organic insulating materials; partial discharges; polymer films; thermal stresses; 23 degC; 70 degC; 90 degC; AC aging; DC aging; breakdown; dielectric film impregnation; high electric fields; lifetimes; maximum-likelihood methods; partial discharges; polypropylene films; power law relation; thermal stresses; transformer oil; two-parameter Weibull distribution; Aging; Breakdown voltage; Dielectric breakdown; Maximum likelihood estimation; Parameter estimation; Partial discharges; Shape; Stress; Temperature; Weibull distribution;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9367
  • Type

    jour

  • DOI
    10.1109/14.34196
  • Filename
    34196