• DocumentCode
    1220033
  • Title

    Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloys

  • Author

    Ohnuma, Ikuo ; Miyashita, Masamitsu ; Liu, Xing Jun ; Ohtani, Hiroshi ; Ishida, Kiyohito

  • Author_Institution
    Dept. of Mater. Sci., Tohoku Univ., Sendai, Japan
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • Firstpage
    84
  • Lastpage
    89
  • Abstract
    We have recently developed a thermodynamic database for micro-soldering alloys, alloy database for micro-solders (ADAMIS). ADAMIS which consists of the elements Ag, Bi, Cu, In, Pb, Sb, Sn, and Zn has been constructed by the calculation of phase diagrams (CALPHAD) method. The thermodynamic parameters for describing the Gibbs energy of the liquid and solid phases have been evaluated by optimizing the experimental data on phase boundaries and thermo-chemical properties. In this paper, the phase equilibria and the related thermodynamic properties pertaining to the Sn-Ag-X (X=Bi, In, Cu, and Zn) alloys are examined using ADAMIS. Typical examples of the isothermal and vertical section phase diagrams, liquidus surface, etc. for these promising lead-free solders are presented. In addition, ADAMIS is also applied to calculate the nonequilibrium solidification process using the Scheil model.
  • Keywords
    bismuth alloys; copper alloys; indium alloys; phase diagrams; phase equilibrium; silver alloys; soldering; solidification; thermodynamic properties; tin alloys; zinc alloys; ADAMIS database; CALPHAD method; Gibbs energy; Scheil model; Sn-Ag based Pb-free solder alloys; SnAgBi; SnAgCu; SnAgIn; SnAgZn; lead-free solders; liquidus surface; micro-soldering alloys; nonequilibrium solidification process; phase boundaries; phase diagrams; phase equilibria; thermodynamic database; thermodynamic properties; Bismuth; Copper alloys; Databases; Environmentally friendly manufacturing techniques; Isothermal processes; Lead; Solids; Thermodynamics; Tin; Zinc;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.813003
  • Filename
    1205226