DocumentCode :
1221072
Title :
Characterization of leakage current in buried-oxide SOI transistors
Author :
Sundaresan, Ravishankar ; Mao, Bor-yen ; Matloubian, Mishel ; Chen, C. E Daniel ; Pollack, Gordon P.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Volume :
36
Issue :
9
fYear :
1989
fDate :
9/1/1989 12:00:00 AM
Firstpage :
1740
Lastpage :
1745
Abstract :
The junction leakage current of MOSFETs built in oxygen-implanted silicon-on-insulator (SOI) substrates has been measured as a function of terminal voltages and temperature. Analysis of the results indicates that the physical mechanism causing the high junction leakage current, typically seen in SOI MOSFETs, is field-enhanced emission of carriers through traps near the buried-oxide/silicon interface. These traps are a consequence of the incorporation of metal impurities during oxygen implantation. The effects of conventional gettering techniques, oxygen dose, and control of metal contamination by modification of implanter design on leakage current are discussed
Keywords :
MOS integrated circuits; electron traps; getters; hole traps; insulated gate field effect transistors; leakage currents; semiconductor-insulator boundaries; MOSFETs; O dose; O implantation; O implanted SOI substrate; SIMOX; Si-SiO2; buried oxide/Si interface; buried-oxide SOI transistors; carriers; field-enhanced emission; gettering techniques; implanter design modification; junction leakage current; metal contamination control; metal impurities; physical mechanism; traps; Contamination; Current measurement; Gettering; Impurities; Leakage current; MOSFETs; Pollution measurement; Silicon on insulator technology; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.34237
Filename :
34237
Link To Document :
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