• DocumentCode
    122112
  • Title

    Fabrication and encapsulation of perovskites sensitized solid state solar cells

  • Author

    Ramos, F. Javier ; Cortes, David ; Aguirre, Ariel ; Castano, Fernando J. ; Ahmad, Sahar

  • Author_Institution
    Abengoa Res., Sevilla, Spain
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    2584
  • Lastpage
    2587
  • Abstract
    Perovskite-based solar cells are now emerging as an economically viable alternative for efficient photovoltaic energy harvesting. Using solution-based processing routes alone, devices with power conversion efficiencies exceeding 15% can be fabricated, in principle at a fraction of costs reported for other photovoltaic technologies. In these excitonic solar cells, the perovskites multifunctional nature allow these layers to behave as light absorber, electron conductor and hole transporting material, depending on the device architecture. In order to further optimize these devices and render them industrial feasible, device stability and encapsulation are of paramount importance. In the present contribution, the fabrication and encapsulation of perovskite-based solar cells will be presented and discussed. To the best of our knowledge this is the first study describing industry relevant encapsulation and device data.
  • Keywords
    encapsulation; energy harvesting; solar cells; device architecture; device stability; electron conductor; encapsulation; excitonic solar cells; hole transporting material; light absorber; multifunctional nature; perovskites sensitized solid state solar cells; photovoltaic energy harvesting; photovoltaic technologies; solution-based processing routes; Current measurement; Encapsulation; Lamination; Materials; Performance evaluation; Photovoltaic cells; Thermal stability; encapsulation; hole transport materials; perovskite; solar cell; solid state;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925459
  • Filename
    6925459