DocumentCode
122127
Title
Printed monolithic interconnects for photovoltaic applications
Author
Fields, Jeremy D. ; Dabney, Matthew S. ; Bollinger, Vincent P. ; van Hest, Maikel F. A. M.
Author_Institution
Nat. Renewable Energy Lab., Golden, CO, USA
fYear
2014
fDate
8-13 June 2014
Abstract
Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially, involving multiple deposition and scribing steps. Interconnect widths on the order of 500 μm every 10 mm result in about 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work introduces an alternative interconnection method capable of producing interconnect widths of less than 100 μm, which can be accomplished in a single pass after deposition of active layers and electrodes. This alternative method can be used for all types of thin film photovoltaics. Voltage addition using printed interconnects and ongoing efforts to optimize performance of modules with printed interconnect are discussed.
Keywords
coating techniques; semiconductor thin films; solar cells; active layers; deposition; electrodes; interconnected solar panel; panel; photovoltaic applications; photovoltaic modules; power generation; printed interconnects; printed monolithic interconnects; thin film photovoltaics; Dielectrics; Electrodes; Ink; Lasers; Nickel; Photovoltaic cells; atmospheric processin; interconnects; photovoltaics;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location
Denver, CO
Type
conf
DOI
10.1109/PVSC.2014.6925474
Filename
6925474
Link To Document