• DocumentCode
    122127
  • Title

    Printed monolithic interconnects for photovoltaic applications

  • Author

    Fields, Jeremy D. ; Dabney, Matthew S. ; Bollinger, Vincent P. ; van Hest, Maikel F. A. M.

  • Author_Institution
    Nat. Renewable Energy Lab., Golden, CO, USA
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Abstract
    Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially, involving multiple deposition and scribing steps. Interconnect widths on the order of 500 μm every 10 mm result in about 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work introduces an alternative interconnection method capable of producing interconnect widths of less than 100 μm, which can be accomplished in a single pass after deposition of active layers and electrodes. This alternative method can be used for all types of thin film photovoltaics. Voltage addition using printed interconnects and ongoing efforts to optimize performance of modules with printed interconnect are discussed.
  • Keywords
    coating techniques; semiconductor thin films; solar cells; active layers; deposition; electrodes; interconnected solar panel; panel; photovoltaic applications; photovoltaic modules; power generation; printed interconnects; printed monolithic interconnects; thin film photovoltaics; Dielectrics; Electrodes; Ink; Lasers; Nickel; Photovoltaic cells; atmospheric processin; interconnects; photovoltaics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925474
  • Filename
    6925474