DocumentCode
122134
Title
The effect of soldering process on solar module performance
Author
Dingyue Cao ; Hong Yang ; He Wang
Author_Institution
MOE Key Lab. for Nonequilibrim Synthese & Modulation of Condensed Matter, Xi´an Jiaotong Univ., Xi´an, China
fYear
2014
fDate
8-13 June 2014
Firstpage
2681
Lastpage
2684
Abstract
The aim of this work is to investigate the effect of soldering technology on solar module performance and reliability. In this study, the flux, the soldering temperature of soldering iron, and the annealing process during soldering process are investigated. Through a series of experiments, some meaningful conclusions which agree with practical production can be summarized as follows: it will be hard to joint if the flux with a low activity, while a too high activity will lead to corrosion at the same time; the optimal soldering temperature range is between 330~350 °C, which causes a low cell breakage rate and a high adhesion; annealing process can lead to less cell crack and low breakage rate by making copper more softer. These results have guiding significance for improving solar module manufacture and further enhancing module reliability and performance.
Keywords
annealing; semiconductor device reliability; solar cells; soldering; annealing process; cell breakage rate; flux; module reliability; solar module performance; soldering iron; soldering temperature; Copper; Indexes; Industries; Iron; Reliability; Soldering; Welding; adhesive strength; manufacturing processes; module reliability; photovoltaic cells; silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location
Denver, CO
Type
conf
DOI
10.1109/PVSC.2014.6925481
Filename
6925481
Link To Document