• DocumentCode
    122134
  • Title

    The effect of soldering process on solar module performance

  • Author

    Dingyue Cao ; Hong Yang ; He Wang

  • Author_Institution
    MOE Key Lab. for Nonequilibrim Synthese & Modulation of Condensed Matter, Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    2681
  • Lastpage
    2684
  • Abstract
    The aim of this work is to investigate the effect of soldering technology on solar module performance and reliability. In this study, the flux, the soldering temperature of soldering iron, and the annealing process during soldering process are investigated. Through a series of experiments, some meaningful conclusions which agree with practical production can be summarized as follows: it will be hard to joint if the flux with a low activity, while a too high activity will lead to corrosion at the same time; the optimal soldering temperature range is between 330~350 °C, which causes a low cell breakage rate and a high adhesion; annealing process can lead to less cell crack and low breakage rate by making copper more softer. These results have guiding significance for improving solar module manufacture and further enhancing module reliability and performance.
  • Keywords
    annealing; semiconductor device reliability; solar cells; soldering; annealing process; cell breakage rate; flux; module reliability; solar module performance; soldering iron; soldering temperature; Copper; Indexes; Industries; Iron; Reliability; Soldering; Welding; adhesive strength; manufacturing processes; module reliability; photovoltaic cells; silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925481
  • Filename
    6925481