DocumentCode :
122136
Title :
Progress toward developing a novel module architecture for increased reliability and reduced costs
Author :
Barth, Kurt L. ; Hemenway, Davis
Author_Institution :
Direct Solar LLC, Fort Collins, CO, USA
fYear :
2014
fDate :
8-13 June 2014
Abstract :
Module reliability has a direct impact on the levalized cost of energy, and reliability issues for thin film PV have been consistently reported. Direct Solar LLC is developing a new module architecture for thin film PV that has robustness to moisture and excellent adhesion under UV light exposure. Process cycle times for each manufacturing step is under 1 minute using low capital cost, small footprint tooling. The patent pending architecture utilizes a specialized two part edge seal. The modules are fabricated without lamination, vacuum pressing or module heating. An initial version of this design has passed IEC 61646 and UL 1703 certification tests and 4500+hrs. of the rigorous 85 C/85% relative humidity “damp heat test”.
Keywords :
cost reduction; reliability; solar cells; thin film devices; IEC 61646; UL 1703 certification tests; UV light exposure; damp heat test; direct solar LLC; energy levalized cost; module architecture; module reliability; patent pending architecture; process cycle times; thin film PV; Glass; Heating; Moisture; Reliability; Seals; encapsulation; manufacturing cost; module reliability; thin film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
Type :
conf
DOI :
10.1109/PVSC.2014.6925483
Filename :
6925483
Link To Document :
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