Title :
Addendum: Modular heat sinks for desktop computers and other electronics
Author :
Klett, James W. ; Trammell, Michael
Author_Institution :
Metals & Ceramics Div., Oak Ridge Nat. Lab., TN, USA
Abstract :
The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks.
Keywords :
cooling; evaporation; heat sinks; thermal management (packaging); thermal resistance; Al; chip package; commercial fan; cooling fluid; copper spreader; desktop computers; electronic device; evaporative cooling technique; graphite foam; heat transfer; modular heat sinks; moment arm; thermal resistance; Aluminum; Bonding; Copper; Electronic packaging thermal management; Electronics cooling; Heat sinks; Resistance heating; Temperature; Thermal force; Thermal resistance;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2004.836731
