Title :
Fuse regrowth kinetics
Author :
Lambert, Don ; Gannamani, Ranjit ; Blish, Richard C., II
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
The kinetics of fuse regrowth during temperature humidity bias (THB) stresses were modeled with a power law for relative humidity (exponent ∼2.3) and a power law for bias voltage (exponent ∼1.7). Using these results we determined the optimal laser cut parameters to maximize product reliability.
Keywords :
electric fuses; electrostatic discharge; integrated circuit reliability; kinetic theory; laser materials processing; printed circuit layout; bias voltage; fuse regrowth kinetics; integrated circuit reliability; laser material-processing applications; optimal laser cut parameters; power law; printed circuit layout; product reliability; relative humidity; reliability modeling; temperature humidity bias stresses; Fuses; Humidity; Integrated circuit reliability; Kinetic theory; Laser beam cutting; Laser modes; Power lasers; Stress; Temperature; Voltage;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2004.838422
