A simple approach for the simulations in the mechanical studies of drilled wafers

The mechanical strength of drilled wafers, according to a EWT or MWT structure, is widely influenced by the presence of holes. In the study of the strength of these samples, the holes should be included in the simulations resulting in very heavy models with high calculation times. The traditional mechanical design for ductile materials with holes is based in the application of stress concentration factors. This method is not valid in this case due to the strength dependence on the size of the loaded area. In this paper, a stress concentration surface is proposed getting a much simpler approach for the simulations with drilled samples.