DocumentCode :
1222061
Title :
Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation
Author :
Bryant, Angus T. ; Mawby, Philip A. ; Palmer, Patrick R. ; Santi, Enrico ; Hudgins, Jerry L.
Author_Institution :
Sch. of Eng., Univ. of Warwick, Coventry
Volume :
44
Issue :
3
fYear :
2008
Firstpage :
894
Lastpage :
903
Abstract :
This paper presents the application of compact insulated gate bipolar transistor and p-i-n diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (the federal urban driving schedule), which is used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with rainflow cycle counting techniques from material fatigue analysis. The effects of ambient temperature, driving style, and converter design on converter reliability are also investigated.
Keywords :
fatigue; hybrid electric vehicles; insulated gate bipolar transistors; p-i-n diodes; power bipolar transistors; power convertors; power semiconductor diodes; semiconductor device models; semiconductor device reliability; table lookup; transients; ambient temperature; electrothermal system simulation; hybrid electric vehicle converter; insulated gate bipolar transistor model; lookup table; material fatigue analysis; p-i-n diode model; power device reliability; rainflow cycle counting technique; transient device temperature profile generation; urban driving cycle; Electrothermal effects; Hybrid electric vehicles; Insulated gate bipolar transistors; Materials reliability; P-i-n diodes; Power system modeling; Power system reliability; Table lookup; Temperature; Vehicle driving; Compact modeling; electrothermal simulation; mission profile; power semiconductor devices; rainflow cycle counting; reliability; thermal cycling;
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2008.921388
Filename :
4523984
Link To Document :
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