DocumentCode :
122301
Title :
Nanoscale electrical properties of wide-bandgap Cu(In,Ga)Se2 and Cu2ZnSn(SSe)4 thin films
Author :
Jiang, C.-S. ; Contreras, M.A. ; Repins, I.L. ; Mansfield, Lorelle M. ; Beall, C. ; Ramanathan, Kannan ; Al-Jassim, M.M.
Author_Institution :
Nat. Renewable Energy Lab. (NREL), Golden, CO, USA
fYear :
2014
fDate :
8-13 June 2014
Firstpage :
3341
Lastpage :
3346
Abstract :
We report microscopic characterization studies of wide-bandgap Cu(In,Ga)Se2 (CIGSe) and wide-bandgap Cu2ZnSn(SSe)4 (CZTSS) thin films using the nanoscale electrical probes of scanning Kelvin force microscopy and scanning spreading resistance microscopy. These films were deposited by the co-evaporation of the elements in a vacuum. The CIGSe films are NREL´s recently improved wide-bandgap devices. The potential imaging shows significant increase in surface potential roughness with increasing the bandgaps, indicating degradation of the film surface by charge-trapping defects. These defects are expected to significantly affect open-circuit voltage after the surfaces are turned to junction upon device completion. The resistance imaging shows increase in both the overall resistance and resistance nonuniformity, likely because of defect scattering to carrier transport.
Keywords :
atomic force microscopy; copper compounds; selenium compounds; semiconductor thin films; surface roughness; tin compounds; wide band gap semiconductors; zinc compounds; CIGSe; CuZnSnSe; NREL; charge-trapping defects; nanoscale electrical properties; open-circuit voltage; resistance imaging; scanning Kelvin force microscopy; spreading resistance microscopy; surface potential roughness; wide-bandgap thin films; Electric potential; Films; Rough surfaces; Surface morphology; Surface resistance; Surface roughness; CIGSe; CZTSS; electrical property; nanometer scale; scanning Kelvin probe force microscopy; scanning spreading resistance microscopy; wide bandgap;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
Type :
conf
DOI :
10.1109/PVSC.2014.6925651
Filename :
6925651
Link To Document :
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