DocumentCode :
1223384
Title :
Substrate bias dependence of breakdown progression in ultrathin oxide pMOSFETs
Author :
Tsai, C.W. ; Chen, M.C. ; Gu, S.H. ; Wang, Tahui
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
Volume :
24
Issue :
4
fYear :
2003
fDate :
4/1/2003 12:00:00 AM
Firstpage :
269
Lastpage :
271
Abstract :
Negative substrate bias-enhanced oxide breakdown (BD) progression in ultrathin oxide (1.4 nm) pMOS is observed. The enhanced progression is attributed to the increase of hole-stress current resulting from BD-induced, channel-carrier heating. The carrier temperature extracted from the spectral distribution of hot-carrier luminescence is around 1300 K. The substrate bias dependence of post-BD hole-tunneling current is confirmed from measurement and calculation. The observed phenomenon is particularly significant to ultrathin gate oxide reliability in floating substrate (SOI) and forward-biased substrate devices.
Keywords :
MOSFET; electroluminescence; hot carriers; semiconductor device breakdown; semiconductor device reliability; silicon-on-insulator; tunnelling; 1.4 nm; breakdown progression; carrier temperature; channel-carrier heating; floating substrate devices; forward-biased substrate devices; hole-stress current; hole-tunneling current; hot-carrier luminescence spectral distribution; negative substrate bias-enhanced oxide breakdown; substrate bias dependence; ultrathin gate oxide reliability; ultrathin oxide pMOSFETs; Charge carrier processes; Circuits; Current measurement; Electric breakdown; Heating; MOSFETs; Stress; Temperature dependence; Temperature distribution; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2003.810890
Filename :
1206860
Link To Document :
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