• DocumentCode
    122339
  • Title

    CdTe thin films doped by Cu and Ag - a comparison in substrate configuration solar cells

  • Author

    Gretener, Christina ; Wyss, Michael ; Perrenoud, Julian ; Kranz, Lukas ; Buecheler, Stephan ; Tiwari, Ayodhya N.

  • Author_Institution
    Lab. for Thin Films & Photovoltaics, Empa-Swiss Fed. Labs. for Mater. Sci. & Technol., Dubendorf, Switzerland
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    3510
  • Lastpage
    3514
  • Abstract
    One of the main problems to be solved in order to raise the efficiency of CdTe solar cells is the low acceptor concentration in polycrystalline CdTe layers which is limiting the open circuit voltage. The commonly used acceptor dopant Cu not only forms rather deep acceptor defects but is also likely to limit the net acceptor concentration due to the formation of compensating donor type defects. In this work, Ag is examined as a possible candidate for improving acceptor concentration in CdTe thin films. Hole density in CdTe layers with varying elemental Ag concentration follows a similar trend as previously reported for Cu doping. In finished solar cells efficiencies up to 11.6 % could be reached using Ag as acceptor dopant. Measurements of hole density, barrier height, space charge region width and depth dependent elemental distribution indicate the similarity of the Ag and Cu doping process.
  • Keywords
    cadmium compounds; copper; silver; solar cells; thin film devices; CdTe:Ag; CdTe:Cu; barrier height measurement; compensation; donor type defect; elemental distribution; hole density measurement; low acceptor dopant concentration; open circuit voltage; polycrystalline layer; solar cell; space charge measurement; thin film; Conductivity; Current measurement; Density measurement; Doping; Photovoltaic cells; Substrates; Temperature measurement; Cadmium compounds; Semiconductor device doping; Silver; photovoltaic cells;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925689
  • Filename
    6925689