Effect of Ni on the Formation of ${\hbox {Cu}}_{6}{\hbox {Sn}}_{5}$ and ${\hbox {Cu}}_{3}{\hbox {Sn}}$

In this paper, the effect of Ni on the formation of Cu₆Sn₅ and Cu₃Sn intermetallics between tin and (Cu,Ni) substrates has been studied by making use of the thermodynamic assessment of the Sn-Cu-Ni system. The driving forces for the diffusion of the elements in the intermetallic layers were calculated as a function of Ni content. Assuming constant mobilities of component atoms, the results suggest that the diffusion fluxes of all the components in the (Cu, Ni)₆Sn₅ layer increase with increasing content of dissolved Ni, while the Cu and Sn fluxes in the (Cu, Ni)₃Sn layer decrease. Therefore, the dissolution of Ni retards the growth of (Cu, Ni)₃Sn. When the Ni content of the (Cu,Ni) substrate is high enough, the intermetallic compound growth in the reaction zones is dominated by (Cu, Ni)₆Sn₅, and the (Cu, Ni)₃Sn layer disappears gradually. The small thickness of (Cu, Ni)₃Sn is associated with large difference between Sn and Cu fluxes in (Cu, Ni)₃Sn that encourages also the "Kirk-endall void" formation. In addition, the calculated driving forces suggest that the growth rate of (Cu, Ni)₆Sn₅ should further increase if (Cu, Ni)₃Sn disappears, resulting in an unusually thick (Cu, Ni)₆Sn₅ layer. The results of thermodynamic calculations supplemented with diffusion kinetic considerations are in good agreements with recent experimental observations.