Title :
Logic Suitability of 50-nm In0.7 Ga0.3As HEMTs for Beyond-CMOS Applications
Author :
Kim, Dae-Hyun ; Del Alamo, Jesus A. ; Lee, Jae.-Hak. ; Seo, Kwang-Seok
Author_Institution :
Massachusetts Inst. of Technol., Cambridge
Abstract :
We have experimentally studied the suitability of nanometer-scale In0.7Ga0.3As high-electron mobility transistors (HEMTs) as an n-channel device for a future high-speed and low-power logic technology for beyond-CMOS applications. To this end, we have fabricated 50- to 150-nm gate-length In0.7Ga0.3As HEMTs with different gate stack designs. This has allowed us to investigate the role of Schottky barrier height (PhiB) and insulator thickness (tins) on the logic characteristics of In0.7Ga0.3As HEMTs. The best 50-nm HEMTs with the highest PhiB and the smallest tins exhibit an ION/IOFF ratio in excess of 104 and a subthreshold slope (S) below 86 mV/dec. These nonoptimized 50-nm In0.7Ga0.3As HEMTs also show a logic gate delay (CV/I) of around 1 ps at a supply voltage of 0.5 V, while maintaining an ION/IOFF ratio above 104, which is comparable to state-of-the-art Si MOSFETs. As one of the alternatives for beyond-CMOS technologies, we believe that InAs-rich InGaAs HEMTs hold a considerable promise.
Keywords :
CMOS logic circuits; III-V semiconductors; Schottky barriers; gallium arsenide; high electron mobility transistors; indium compounds; low-power electronics; nanoelectronics; InGaAs - Interface; Schottky barrier height; beyond-CMOS technology; high-electron mobility transistors; insulator thickness; logic gate delay; logic suitability; low-power logic technology; n-channel device; size 50 nm to 150 nm; subthreshold slope; voltage 0.5 V; Delay; HEMTs; Insulation; Logic devices; Logic gates; MODFETs; MOSFETs; Nanoscale devices; Schottky barriers; Voltage; $f_{T}$; $I_{rm ON}/I_{rm OFF}$; $hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$; Drain-induced barrier lowering (DIBL); gate delay; high-electron mobility transistor (HEMT); logic; subthreshold slope;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2007.904986