DocumentCode :
1225782
Title :
Special Issue on Packaging Reliability
Volume :
54
Issue :
10
fYear :
2007
Firstpage :
2812
Lastpage :
2812
Abstract :
Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.908204
Filename :
4317741
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1225782
