DocumentCode
1226012
Title
Quantitative Evaluation of Statistical Variability Sources in a 45-nm Technological Node LP N-MOSFET
Author
Cathignol, Augustin ; Cheng, B. ; Chanemougame, D. ; Brown, A.R. ; Rochereau, K. ; Ghibaudo, G. ; Asenov, A.
Author_Institution
STMicroelectronics, Crolles
Volume
29
Issue
6
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
609
Lastpage
611
Abstract
A quantitative evaluation of the contributions of different sources of statistical variability, including the contribution from the polysilicon gate, is provided for a low-power bulk N-MOSFET corresponding to the 45-nm technology generation. This is based on a joint study including both experimental measurements and ldquoatomisticrdquo simulations on the same fully calibrated device. The position of the Fermi-level pinning in the polysilicon bandgap that takes place along grain boundaries was evaluated, and polysilicon-gate-granularity contribution was compared to the contributions of other variability sources. The simulation results indicate that random discrete dopants are still the dominant intrinsic source of statistical variability, while the role of polysilicon-gate granularity is highly dependent on Fermi-level pinning position and, consequently, on the structure of the polysilicon-gate material and its deposition and annealing conditions.
Keywords
Fermi level; MOSFET; elemental semiconductors; silicon; statistical analysis; Fermi-level pinning position; N-MOSFET; Si; polysilicon bandgap; polysilicon-gate-granularity; random discrete dopant; size 45 nm; statistical variability; Boron; Fluctuations; Grain boundaries; Implants; Length measurement; MOSFET circuits; Manufacturing; Photonic band gap; Simulated annealing; Thickness measurement; MOSFET; Matching; mismatch; parameter fluctuations; variability;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.922978
Filename
4526755
Link To Document