• DocumentCode
    1226108
  • Title

    Review: Semiconductor Piezoresistance for Microsystems

  • Author

    Barlian, A. Alvin ; Park, Woo-Tae ; Mallon, Joseph R., Jr. ; Rastegar, Ali J. ; Pruitt, Beth L.

  • Author_Institution
    Mech. Eng., Stanford Univ., Stanford, CA
  • Volume
    97
  • Issue
    3
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    513
  • Lastpage
    552
  • Abstract
    Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.
  • Keywords
    micromachining; micromechanical devices; microsensors; piezoresistive devices; electrical noise; microelectromechanical systems; micromachined silicon devices; micromachining technology; microsystems; piezoresistors; semiconductor piezoresistance; Microelectromechanical systems; Micromachining; Micromechanical devices; Piezoresistive devices; Sensor systems; Silicon devices; MEMS; microfabrication; micromachining; microsensors; piezoresistance; piezoresistor; sensors;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2009.2013612
  • Filename
    4811093