Title :
Chip making´s singular future
Author :
Singh, Rajendra ; Thakur, Randhir
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Abstract :
Making chips a single wafer at a time can reduce chip oversupply and help ensure sustainable growth in the semiconductor industry.
Keywords :
integrated circuit manufacture; lithography; monolithic integrated circuits; semiconductor device packaging; wafer bonding; fabrication process; integrated circuit; lithography; packaging technique; semiconductor chip; semiconductor industry; silicon wafer; wafer manufacturing; Costs; Manufacturing processes; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging; Switches; Transistors; Wafer scale integration;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.2005.1389515
