• DocumentCode
    1226548
  • Title

    Chip making´s singular future

  • Author

    Singh, Rajendra ; Thakur, Randhir

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
  • Volume
    42
  • Issue
    2
  • fYear
    2005
  • Firstpage
    40
  • Lastpage
    45
  • Abstract
    Making chips a single wafer at a time can reduce chip oversupply and help ensure sustainable growth in the semiconductor industry.
  • Keywords
    integrated circuit manufacture; lithography; monolithic integrated circuits; semiconductor device packaging; wafer bonding; fabrication process; integrated circuit; lithography; packaging technique; semiconductor chip; semiconductor industry; silicon wafer; wafer manufacturing; Costs; Manufacturing processes; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging; Switches; Transistors; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2005.1389515
  • Filename
    1389515
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1226548