Interconnect Macromodeling From 3-D Field Computation

This paper presents a macromodeling technique allowing a global circuit simulation of electromagnetic problems. In the proposed methodology the whole 3D structure can be subdivided into smaller parts. Each part is characterized by an equivalent circuit deduced from wide-band analysis. The connection between the substructures makes available a global simulation of the whole system inside a circuit platform (SPICE for example). The ability of the approach is demonstrated in case of different kinds of interconnects (tracks and cables).