Title :
A microfabricated wall shear-stress sensor with capacitative sensing
Author :
Zhe, Jiang ; Modi, Vijay ; Farmer, Kenneth R., Jr.
Author_Institution :
Dept. of Mech. Eng., Columbia Univ., New York, NY, USA
Abstract :
A silicon-based micromachined, floating-element sensor for low-magnitude wall shear-stress measurement has been developed. Sensors over a range of element sizes and sensitivities have been fabricated by thin-wafer bonding and deep-reactive ion-etching techniques. Detailed design, fabrication, and testing issues are described in this paper. Detection of the floating-element motion is accomplished using either direct or differential capacitance measurement. The design objective is to measure the shear-stress distribution at levels of O(0.10 Pa) with a spatial resolution of approximately O(100 μm). It is assumed that the flow direction is known, permitting one to align the sensor appropriately so that a single component shear measurement is a good estimate of the prevalent shear. Using a differential capacitance detection scheme these goals have been achieved. We tested the sensor at shear levels ranging from 0 to 0.20 Pa and found that the lowest detectable shear-stress level that the sensor can measure is 0.04 Pa with an 8% uncertainty on a 200 μm×500 μm floating element plate.
Keywords :
capacitive sensors; micromachining; microsensors; sputter etching; stress measurement; wafer bonding; capacitative sensing; component shear measurement; deep-reactive ion-etching; differential capacitance detection; differential capacitance measurement; floating element plate; floating-element motion; low-magnitude wall shear-stress measurement; microfabricated wall shear-stress sensor; microsensor; shear-stress distribution; silicon-based micromachined floating-element sensor; thin-wafer bonding; Capacitance; Capacitive sensors; Electrodes; Force sensors; Micromechanical devices; Semiconductor device measurement; Stress; Structural beams; Testing; Velocity measurement;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2004.839001