Title :
A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds
Author :
Carrillo-Ramirez, Rodrigo ; Jackson, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
A low cost interconnection scheme for millimeter wave modules is presented. This technique allows the integration of hybrid components using an inexpensive micromachined silicon motherboard and benzocyclobutene (BCB) films. The excellent planarity of BCB allows vias to be formed using bumps fabricated prior to BCB application. This approach eliminates the need for laser drilling, plasma etching, and plated holes. Several representative GaAs pHEMT´s were packaged using this technique. Measurements show minimal performance degradation from 1 GHz to 48 GHz.
Keywords :
MIMIC; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; micromachining; multichip modules; 1 to 48 GHz; BCB film; GaAs; GaAs pHEMT; MCM packaging technology; Si; bump bond; hybrid component; interconnection technique; micromachined silicon motherboard; millimeter-wave integrated circuit; Costs; Drilling; Integrated circuit interconnections; Millimeter wave integrated circuits; Millimeter wave technology; Plasma applications; Plasma measurements; Plasma waves; Semiconductor films; Silicon;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2003.811677
