Title :
DEPACT: delay extraction-based passive compact transmission-line macromodeling algorithm
Author :
Nakhla, Natalie M. ; Dounavis, Anestis ; Achar, Ramachandra ; Nakhla, Michel S.
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont.
Abstract :
With the continually increasing operating frequencies, signal integrity and interconnect analysis in high-speed designs is becoming increasingly important. Recently, several algorithms were proposed for macromodeling and transient analysis of distributed transmission line interconnect networks. The techniques such as method-of-characteristics (MoC) yield fast transient results for long delay lines. However, they do not guarantee the passivity of the macromodel. It has been demonstrated that preserving passivity of the macromodel is essential to guarantee a stable global transient simulation. On the other hand, methods such as matrix rational approximation (MRA) provide efficient macromodels for lossy coupled lines, while preserving the passivity. However, for long lossy delay lines this may require higher order approximations, making the macromodel inefficient. To address the above difficulties, this paper presents a new algorithm for passive and compact macromodeling of distributed transmission lines. The proposed method employs delay extraction prior to approximating the exponential stamp to generate compact macromodels, while ensuring the passivity. Validity and efficiency of the proposed algorithm is demonstrated using several benchmark examples
Keywords :
circuit simulation; integrated circuit interconnections; integrated circuit modelling; multiconductor transmission lines; printed circuits; transient analysis; transmission line matrix methods; circuit simulation; compact macromodels; delay extraction; distributed interconnects; distributed transmission line interconnect networks; distributed transmission lines; high-speed modules; matrix rational approximation; method-of-characteristics; multiconductor transmission lines; passive macromodels; printed circuit boards; transient analysis; transmission line macromodeling algorithm; Algorithm design and analysis; Circuit simulation; Couplings; Delay lines; Frequency; Integrated circuit interconnections; Power system transients; Transient analysis; Transmission line matrix methods; Transmission lines; Circuit simulation; delay extraction; distributed interconnects; high-speed modules; matrix rational approximation (MRA); method of characteristics (MoC); multiconductor transmission lines; passive macromodels; printed circuit boards; transient analysis;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2004.841677