Title :
Discrete Dopant Fluctuations in 20-nm/15-nm-Gate Planar CMOS
Author :
Li, Yiming ; Yu, Shao-Ming ; Hwang, Jiunn-Ren ; Yang, Fu-Liang
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu
fDate :
6/1/2008 12:00:00 AM
Abstract :
We experimentally quantified, for the first time, the random dopant distribution (RDD)-induced threshold voltage standard deviation up to 40 mV for 20-nm-gate planar complementary metal-oxide-semiconductor (CMOS) field-effect transistors. Discrete dopants have been statistically positioned in the 3-D channel region to examine the associated carrier transportation characteristics, concurrently capturing ldquodopant concentration variationrdquo and ldquodopant position fluctuation.rdquo As the gate length further scales down to 15 nm, the newly developed discrete dopant scheme features an effective solution to suppress the 3-sigma-edge single-digit dopant-induced variation by the gate work function modulation. The results of this paper may postpone the scaling limit projected for planar CMOS.
Keywords :
CMOS integrated circuits; fluctuations; 3-sigma-edge single-digit dopant-induced variation; complementary metal-oxide-semiconductor field-effect transistors; discrete dopant fluctuations; dopant concentration variation; dopant position fluctuation; planar CMOS; random dopant distribution induced threshold voltage; size 15 nm; size 20 nm; standard deviation; voltage 40 mV; Double-gate FETs; Fluctuations; Moore´s Law; Road transportation; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling; Three dimensional displays; Threshold voltage; Transistors; 3-D modeling and simulation; Complementary metal–oxide–semiconductor (CMOS) device; dopant concentration variation; dopant position fluctuation; random dopant distribution (RDD); threshold voltage fluctuation;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2008.921991