DocumentCode :
1229004
Title :
Rinse strategy [PC board manufacture]
Author :
McBride, Donald G.
Author_Institution :
Sci. & Technol. Associates, Binghamton, NY, USA
Volume :
12
Issue :
1
fYear :
1996
fDate :
1/1/1996 12:00:00 AM
Firstpage :
20
Lastpage :
22
Abstract :
The rinse strategy has been conceived and tested in aqueous and gaseous environments. There are significant environmental benefits: water usage and waste stream reduction are optimized. Chemical volume is reduced. There are process uniformity and control improvements. The number of process steps is reduced, and there have been enhancements to the process rate. Yield is enhanced and costs are reduced. Smaller expenditures are required to achieve spectacular results. Current equipment can be retrofitted at a small cost. New equipment can be designed and built at a fraction of the cost of standard off-the-shelf equipment for any wet or dry process
Keywords :
environmental factors; planning; printed circuit manufacture; surface cleaning; PC board manufacture; aqueous environments; chemical volume; dry process; environmental benefits; gaseous environments; process rate; process uniformity; rinse strategy; waste stream reduction; water usage; wet process; Chemical processes; Cleaning; Conductivity; Engineering profession; Etching; Floods; Manufacturing processes; Monitoring; Project management; Resins;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/101.481205
Filename :
481205
Link To Document :
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