Title :
Kraftwerk2—A Fast Force-Directed Quadratic Placement Approach Using an Accurate Net Model
Author :
Spindler, Peter ; Schlichtmann, Ulf ; Johannes, Frank M.
Author_Institution :
Inst. for Electron. Design Autom., Tech. Univ. Munchen, Munich
Abstract :
The force-directed quadratic placer ldquoKraftwerk2,rdquo as described in this paper, is based on two main concepts. First, the force that is necessary to distribute the modules on the chip is separated into the following two components: a hold force and a move force. Both components are implemented in a systematic manner. Consequently, Kraftwerk2 converges such that the module overlap is reduced in each placement iteration. The second concept of Kraftwerk2 is to use the ldquoBound2Boundrdquo net model, which accurately represents the half-perimeter wirelength (HPWL) in the quadratic cost function. Aside from these features, this paper presents additional details about Kraftwerk2. An approach to remove halos (free space) around large modules is described, and a method to control the module density is presented. In order to choose the important tradeoff between runtime and quality, a systematic quality control is shown. Furthermore, plots demonstrating the convergence of Kraftwerk2 are presented. Results using various benchmark suites demonstrate that Kraftwerk2 offers both high quality and excellent computational efficiency.
Keywords :
circuit layout CAD; circuit optimisation; integrated circuit layout; integrated circuit modelling; iterative methods; modules; quadratic programming; quality control; Bound2Bound net model; Kraftwerk2; Kraftwerk2 convergence; accurate net model; computational efficiency; fast force-directed quadratic placement approach; half-perimeter wirelength; module density control; module overlap reduction; modules distribution; placement iteration; quadratic cost function; systematic quality control; Bound2Bound; HPWL; Kraftwerk2; force-directed; half-perimeter wirelength (HPWL); quadratic placement;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2008.925783